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M45PE40S-VMP6TG TR

M45PE40S-VMP6TG TR

  • 厂商:

    MICRON(镁光)

  • 封装:

    VDFN-8

  • 描述:

    IC FLASH 4MBIT SPI 75MHZ 8VFQFPN

  • 数据手册
  • 价格&库存
M45PE40S-VMP6TG TR 数据手册
75MHz, Serial Peripheral Interface Flash Memory Features Micron Serial NOR Flash Memory 3V, 4Mb Page Erasable with Byte Alterability M45PE40 Features • • • • • • • • • • • • SPI bus-compatible serial interface 75 MHz clock frequency (MAX) 2.7–3.6V single supply voltage 4Mb of page-erasable Flash memory Page size: 256 bytes – Page write: 11ms (TYP) – Page program: 0.8ms (TYP) – Page erase: 10ms (TYP) Sector erase: 64KB Hardware write protection of the bottom memory area 64KB Electronic signature – JEDEC-standard, 2-byte signature (4013h) Deep power-down mode: 1µA (TYP) WRITE cycles per sector: >100,000 Years of data retention: >20 Packages (RoHS-compliant) – VFQFPN8 (MP) 6mm x 5mm – SO8W (MW) 208 mil – SO8N (MN) 150 mil PDF: 09005aef845660fc m45pe40.pdf - Rev. D 08/15 EN 1 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2011 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice. 75MHz, Serial Peripheral Interface Flash Memory Features Contents Functional Description ..................................................................................................................................... 5 Signal Descriptions ........................................................................................................................................... 7 Configuration and Memory Map ....................................................................................................................... 8 Memory Configuration and Block Diagram .................................................................................................... 8 Memory Map – 4Mb Density ............................................................................................................................. 9 Operating Features Overview .......................................................................................................................... 10 Sharing the Overhead of Modifying Data ..................................................................................................... 10 Easy Method to Modify Data ....................................................................................................................... 10 Fast Method to Modify Data ........................................................................................................................ 10 Polling During a WRITE, PROGRAM, or ERASE Cycle ................................................................................... 11 Reset .......................................................................................................................................................... 11 Active Power, Standby Power, and Deep Power-Down .................................................................................. 11 Status Register ............................................................................................................................................ 11 Protection Modes ....................................................................................................................................... 11 Serial Peripheral Interface Modes .................................................................................................................... 13 Command Set Overview ................................................................................................................................. 15 WRITE ENABLE .............................................................................................................................................. 17 WRITE DISABLE ............................................................................................................................................. 18 READ IDENTIFICATION ................................................................................................................................. 19 READ STATUS REGISTER ................................................................................................................................ 20 WIP Bit ...................................................................................................................................................... 21 WEL Bit ...................................................................................................................................................... 21 READ DATA BYTES ......................................................................................................................................... 22 READ DATA BYTES at HIGHER SPEED ............................................................................................................ 23 PAGE WRITE .................................................................................................................................................. 24 PAGE PROGRAM ............................................................................................................................................ 25 PAGE ERASE ................................................................................................................................................... 26 SECTOR ERASE .............................................................................................................................................. 27 DEEP POWER-DOWN ..................................................................................................................................... 28 RELEASE from DEEP POWER-DOWN .............................................................................................................. 29 Electrical Characteristics ................................................................................................................................ 30 Maximum Ratings and Operating Conditions .................................................................................................. 31 AC Characteristics .......................................................................................................................................... 32 Package Information ...................................................................................................................................... 38 Device Ordering Information .......................................................................................................................... 41 Standard Parts ............................................................................................................................................ 41 Revision History ............................................................................................................................................. 42 Rev. D – 08/15 ............................................................................................................................................. 42 Rev. C – 03/14 ............................................................................................................................................. 42 Rev. B – 06/13 ............................................................................................................................................. 42 Rev. A – 05/13 ............................................................................................................................................. 42 PDF: 09005aef845660fc m45pe40.pdf - Rev. D 08/15 EN 2 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2011 Micron Technology, Inc. All rights reserved. 75MHz, Serial Peripheral Interface Flash Memory Features List of Figures Figure 1: Logic Diagram ................................................................................................................................... 5 Figure 2: Pin Connections: VFQFPN and SO ..................................................................................................... 6 Figure 3: Block Diagram .................................................................................................................................. 8 Figure 4: Bus Master and Memory Devices on the SPI Bus ............................................................................... 14 Figure 5: SPI Modes ....................................................................................................................................... 14 Figure 6: WRITE ENABLE Command Sequence .............................................................................................. 17 Figure 7: WRITE DISABLE Command Sequence ............................................................................................. 18 Figure 8: READ IDENTIFICATION Command Sequence ................................................................................. 20 Figure 9: READ STATUS REGISTER Command Sequence ................................................................................ 20 Figure 10: Status Register Format ................................................................................................................... 21 Figure 11: READ DATA BYTES Command Sequence ........................................................................................ 22 Figure 12: READ DATA BYTES at HIGHER SPEED Command Sequence ........................................................... 23 Figure 13: PAGE WRITE Command Sequence ................................................................................................. 24 Figure 14: PAGE PROGRAM Command Sequence ........................................................................................... 25 Figure 15: SECTOR ERASE Command Sequence ............................................................................................. 26 Figure 16: SECTOR ERASE Command Sequence ............................................................................................. 27 Figure 17: DEEP POWER-DOWN Command Sequence ................................................................................... 28 Figure 18: RELEASE from DEEP POWER-DOWN Command Sequence ............................................................. 29 Figure 19: AC Measurement I/O Waveform ..................................................................................................... 32 Figure 20: Serial Input Timing ........................................................................................................................ 36 Figure 21: Write Protect Setup and Hold Timing ............................................................................................. 36 Figure 22: Output Timing .............................................................................................................................. 37 Figure 23: Reset AC Waveforms ...................................................................................................................... 37 Figure 24: VFQFPN8 (MLP8) 6mm x 5mm ...................................................................................................... 38 Figure 25: SO8N 150 mils Body Width ............................................................................................................ 39 Figure 26: SO8W 208 mils Body Width ............................................................................................................ 40 PDF: 09005aef845660fc m45pe40.pdf - Rev. D 08/15 EN 3 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2011 Micron Technology, Inc. All rights reserved. 75MHz, Serial Peripheral Interface Flash Memory Features List of Tables Table 1: Signal Names ...................................................................................................................................... 5 Table 2: Signal Descriptions ............................................................................................................................. 7 Table 3: Sectors[7:0] ........................................................................................................................................ 9 Table 4: SPI Modes ........................................................................................................................................ 13 Table 5: Command Set Codes ........................................................................................................................ 16 Table 6: READ IDENTIFICATION Data-Out Sequence ..................................................................................... 19 Table 7: DC Current Specifications ................................................................................................................. 30 Table 8: DC Voltage Specifications ................................................................................................................. 30 Table 9: Absolute Maximum Ratings .............................................................................................................. 31 Table 10: Operating Conditions ...................................................................................................................... 31 Table 11: AC Measurement Conditions ........................................................................................................... 32 Table 12: Capacitance .................................................................................................................................... 32 Table 13: AC Specifications (50 MHz) ............................................................................................................. 33 Table 14: AC Specifications (75MHz) .............................................................................................................. 34 Table 15: Reset Specifications ........................................................................................................................ 35 Table 16: Part Number Information Scheme ................................................................................................... 41 PDF: 09005aef845660fc m45pe40.pdf - Rev. D 08/15 EN 4 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2011 Micron Technology, Inc. All rights reserved. 75MHz, Serial Peripheral Interface Flash Memory Functional Description Functional Description The M45PE40 is a 4Mb (512Kb x 8) serial Flash memory device accessed by a highspeed, SPI-compatible bus. The memory can be written or programmed 1 to 256 bytes at a time using the PAGE WRITE or PAGE PROGRAM command. The PAGE WRITE command consists of an integrated PAGE ERASE cycle followed by a PAGE PROGRAM cycle. The memory is organized as 8 sectors, each containing 256 pages. Each page is 256 bytes wide. The entire memory can be viewed as consisting of 2048 pages, or 524,288 bytes. The memory can be erased one page at a time using the PAGE ERASE command or one sector at a time using the SECTOR ERASE command. Figure 1: Logic Diagram VCC DQ0 DQ1 C S# W# RESET# VSS Table 1: Signal Names Signal Name Function Direction C Serial clock Input DQ0 Serial data input Input DQ1 Serial data output Output S# Chip select Input W# Write protect Input RESET# Reset Input VCC Supply voltage – VSS Ground – PDF: 09005aef845660fc m45pe40.pdf - Rev. D 08/15 EN 5 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2011 Micron Technology, Inc. All rights reserved. 75MHz, Serial Peripheral Interface Flash Memory Functional Description Figure 2: Pin Connections: VFQFPN and SO 1 8 DQ1 C 2 7 VSS RESET# 3 6 VCC S# 4 5 W# DQ0 There is an exposed central pad on the underside of the VFQFPN package that is pulled internally to V SS and must not be connected to any other voltage or signal line on the PCB. The Package Information section provides details about package dimensions and how to identify pin 1. PDF: 09005aef845660fc m45pe40.pdf - Rev. D 08/15 EN 6 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2011 Micron Technology, Inc. All rights reserved. 75MHz, Serial Peripheral Interface Flash Memory Signal Descriptions Signal Descriptions Table 2: Signal Descriptions Signal Type Description DQ0 Input Serial data: Transfers data serially into the device. DQ0 receives commands, addresses, and data to be programmed. Values are latched on the rising edge of serial clock (C). C Input Clock: Provides timing for the serial interface. Commands, addresses, or data present at serial data input (DQ0) is latched on the rising edge of serial clock (C). Data on DQ1 changes after the falling edge of C. S# Input Chip select: When S# is HIGH, the device is deselected and DQ1 is High-Z. Unless an internal READ, PROGRAM, ERASE, or WRITE cycle is in progress, the device will be in the standby power mode (not deep power-down mode). Driving S# LOW enables the device, placing it in the active power mode. After power-up, a falling edge on S# is required prior to the start of any command. RESET# Input Reset: Provides a hardware reset for the memory. When RESET# is driven HIGH, the device is in the normal operating mode. When RESET# is driven LOW, the device enters the reset mode. In reset mode, the output is High-Z. Driving RESET# LOW while an internal operation is in progress affects the WRITE, PROGRAM, or ERASE cycle, and data may be lost. W# Input Write protect: Places the device in hardware protected mode when connected to VSS, causing the first 256 pages of memory to become read-only, protected from WRITE, PROGRAM, and ERASE operations. When W# is connected to VCC, the first 256 pages of memory behave like the other pages. DQ1 Output Serial data: Transfers data serially out of the device. Data is shifted out on the falling edge of the serial clock (C). VCC Supply Supply voltage: 2.7–3.6V VSS Supply Ground: Reference for VCC. PDF: 09005aef845660fc m45pe40.pdf - Rev. D 08/15 EN 7 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2011 Micron Technology, Inc. All rights reserved. 75MHz, Serial Peripheral Interface Flash Memory Configuration and Memory Map Configuration and Memory Map Memory Configuration and Block Diagram Each page of memory can be individually programmed; bits are programmed from 1 to 0 and when written to are changed to either 0 or 1. The device is sector- and page-erasable; bits are erased from 0 to 1. The memory is configured as follows: • 524,288 bytes (8 bits each) • 8 sectors (512Kb, 65KB each) • 2048 pages (256 bytes each) Figure 3: Block Diagram RESET# W# High Voltage Generator Control Logic S# C DQ0 I/O Shift Register DQ1 Address Register and Counter Status Register 256 Byte Data Buffer Y Decoder 7FFFFh 10000h (Note 1) 00000h 000FFh 256 bytes (page size) X Decoder PDF: 09005aef845660fc m45pe40.pdf - Rev. D 08/15 EN 8 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2011 Micron Technology, Inc. All rights reserved. 75MHz, Serial Peripheral Interface Flash Memory Memory Map – 4Mb Density Memory Map – 4Mb Density Table 3: Sectors[7:0] Address Range Sector Start End 7 0007 0000h 0007 FFFFh 6 0006 0000h 0006 FFFFh 5 0005 0000h 0005 FFFFh 4 0004 0000h 0004 FFFFh 3 0003 0000h 0003 FFFFh 2 0002 0000h 0002 FFFFh 1 0001 0000h 0001 FFFFh 0 0000 0000h 0000 FFFFh PDF: 09005aef845660fc m45pe40.pdf - Rev. D 08/15 EN 9 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2011 Micron Technology, Inc. All rights reserved. 75MHz, Serial Peripheral Interface Flash Memory Operating Features Overview Operating Features Overview Sharing the Overhead of Modifying Data To write or program 1 or more data bytes, two commands are required: WRITE ENABLE which is 1 byte, and a PAGE WRITE or PAGE PROGRAM command sequence, which consists of 4 bytes plus data. This is followed by the internal cycle of duration tPW or tPP. To share this overhead, the PAGE WRITE or PAGE PROGRAM command allows up to 256 bytes to be programmed (changing bits from 1 to 0) or written (changing bits to 0 or 1) at a time, provided that they lie in consecutive addresses on the same page of memory. Easy Method to Modify Data The PAGE WRITE command provides a convenient way of modifying data (up to 256 contiguous bytes at a time) and requires the start address and the new data in the instruction sequence. The PAGE WRITE command is entered by driving chip select (S#) LOW, and then transmitting the instruction byte, 3 address bytes A[23:0] and at least 1 data byte, and then driving S# HIGH. While S# is being held LOW, the data bytes are written to the data buffer, starting at the address given in the third address byte A[7:0]. When S# is driven HIGH, the WRITE cycle starts. The remaining unchanged bytes of the data buffer are automatically loaded with the values of the corresponding bytes of the addressed memory page. The addressed memory page is then automatically put into an ERASE cycle. Finally, the addressed memory page is programmed with the contents of the data buffer. All of this buffer management is handled internally, and is transparent to the user. The user may alter the contents of the memory on a byte-by-byte basis. For optimized timings, it is recommended to use the PAGE WRITE command to write all consecutive targeted bytes in a single sequence versus using several PAGE WRITE sequences with each containing only a few bytes. Fast Method to Modify Data The PAGE PROGRAM command provides a fast way of modifying data (up to 256 contiguous bytes at a time), provided that it only involves resetting bits to 0 that had previously been set to 1. This might be: • When the designer is programming the device for the first time. • When the designer knows that the page has already been erased by an earlier PAGE ERASE or SECTOR ERASE command. This is useful, for example, when storing a fast stream of data, having first performed the erase cycle when time was available. • When the designer knows that the only changes involve resetting bits to 0 that are still set to 1. When this method is possible, it has the additional advantage of minimizing the number of unnecessary ERASE operations and the extra stress incurred by each page. For optimized timings, it is recommended to use the PAGE PROGRAM command to program all consecutive targeted bytes in a single sequence versus using several PAGE PROGRAM sequences with each containing only a few bytes. PDF: 09005aef845660fc m45pe40.pdf - Rev. D 08/15 EN 10 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2011 Micron Technology, Inc. All rights reserved. 75MHz, Serial Peripheral Interface Flash Memory Operating Features Overview Polling During a WRITE, PROGRAM, or ERASE Cycle The following commands can be completed faster by not waiting for the worst-case delay (tW, tPP, tPE, tBE, or tSE). The write in progress (WIP) bit is provided in the status register so that the application program can monitor this bit in the status register, polling it to establish when the previous WRITE, PROGRAM, or ERASE cycle is complete. Reset An internal power-on reset circuit helps protect against inadvertent data writes. Additional protection is provided by driving RESET# LOW during the power-on process, and driving it HIGH only when V CC has reached the correct voltage level, V CC,min. Active Power, Standby Power, and Deep Power-Down When chip select (S#) is LOW, the device is selected and in the active power mode. When S# is HIGH, the device is deselected, but could remain in the active power mode until all internal cycles have completed (PROGRAM, ERASE, WRITE). The device then goes in to the standby power mode, and power consumption drops to ICC1. The deep power-down mode is entered when the DEEP POWER-DOWN command is executed. The device power consumption drops further to I CC2. The device remains in this mode until the RELEASE FROM DEEP POWER-DOWN command is executed. While in the deep power-down mode, the device ignores all WRITE, PROGRAM, and ERASE commands. This provides an extra software protection mechanism when the device is not in active use, by protecting the device from inadvertent WRITE, PROGRAM, or ERASE operations. For further information, see the DEEP POWER-DOWN section. Status Register The status register contains a number of status bits that can be read by the READ STATUS REGISTER (RDSR) command. For a detailed description of the status register bits, see the READ STATUS REGISTER section. Protection Modes Nonvolatile memory is used in environments that can include excessive noise. The following capabilities help protect data in these noisy environments. Power-on reset and an internal timer (tPUW) can provide protection against inadvertent changes while the power supply is outside the operating specification. WRITE, PROGRAM, and ERASE commands are checked before they are accepted for execution to ensure they consist of a number of clock pulses that is a multiple of eight. All commands that modify data must be preceded by a WRITE ENABLE command to set the write enable latch (WEL) bit. This bit is returned to its reset state by the following events. • • • • • PDF: 09005aef845660fc m45pe40.pdf - Rev. D 08/15 EN Power-up Reset (RESET#) driven LOW WRITE DISABLE command completion PAGE WRITE command completion PAGE PROGRAM command completion 11 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2011 Micron Technology, Inc. All rights reserved. 75MHz, Serial Peripheral Interface Flash Memory Operating Features Overview • PAGE ERASE command completion • SECTOR EASE command completion The hardware-protected mode is entered when W# is driven LOW, causing the first 256 pages of memory to become read-only. When W# is driven HIGH, the first 256 pages of memory behave like the other pages of memory. The RESET# signal can be driven LOW to freeze and reset the internal logic. In addition to the low power-consumption feature, deep power-down mode offers extra software protection from inadvertent WRITE, PROGRAM, and ERASE commands while the device is not in active use. PDF: 09005aef845660fc m45pe40.pdf - Rev. D 08/15 EN 12 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2011 Micron Technology, Inc. All rights reserved. 75MHz, Serial Peripheral Interface Flash Memory Serial Peripheral Interface Modes Serial Peripheral Interface Modes The device can be driven by a microcontroller while its serial peripheral interface is in either of the two modes shown in the following table. The difference between the two modes is the clock polarity when the bus master is in standby mode and not transferring data. Input data is latched in on the rising edge of the clock, and output data is available from the falling edge of the clock. Table 4: SPI Modes Note: Note 1 applies to the entire table SPI Modes Clock Polarity CPOL = 0, CPHA = 0 C remains at 0 for (CPOL = 0, CPHA = 0) CPOL = 1, CPHA = 1 C remains at 1 for (CPOL = 1, CPHA = 1) 1. The listed SPI modes are supported in extended, dual, and quad SPI protocols. The following figures show an example of three memory devices in extended SPI protocol in a simple connection to an MCU on a SPI bus. Because only one device is selected at a time, that one device drives DQ1, while the other devices are High-Z. Resistors ensure that the device is not selected if the bus master leaves chip select (S#) High-Z. The bus master might enter a state in which all input/output is High-Z simultaneously, such as when the bus master is reset. Therefore, the serial clock must be connected to an external pull-down resistor so that S# is pulled HIGH while the serial clock is pulled LOW. This ensures that S# and the serial clock are not HIGH simultaneously and that tSHCH is met. The typical resistor value of 100kΩ, assuming that the time constant R × Cp (Cp = parasitic capacitance of the bus line), is shorter than the time the bus master leaves the SPI bus in High-Z. Example: Cp = 50 pF, that is R × Cp = 5μs. The application must ensure that the bus master never leaves the SPI bus High-Z for a time period shorter than 5μs. W# and HOLD# should be driven either HIGH or LOW, as appropriate. PDF: 09005aef845660fc m45pe40.pdf - Rev. D 08/15 EN 13 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2011 Micron Technology, Inc. All rights reserved. 75MHz, Serial Peripheral Interface Flash Memory Serial Peripheral Interface Modes Figure 4: Bus Master and Memory Devices on the SPI Bus VSS VCC R SDO SPI interface with (CPOL, CPHA) = (0, 0) or (1, 1) SDI SCK C VCC SPI bus master DQ1 DQ0 SPI memory device R CS3 CS2 VCC C VSS DQ1 DQ0 SPI memory device R VCC C VSS R DQ1 DQ0 VSS SPI memory device CS1 S# W# RESET# S# W# RESET# S# W# RESET# Figure 5: SPI Modes CPOL CPHA 0 0 C 1 1 C DQ0 MSB DQ1 PDF: 09005aef845660fc m45pe40.pdf - Rev. D 08/15 EN MSB 14 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2011 Micron Technology, Inc. All rights reserved. 75MHz, Serial Peripheral Interface Flash Memory Command Set Overview Command Set Overview All commands, addresses, and data are shifted in and out of the device, most significant bit first. Serial data inputs DQ0 and DQ1 are sampled on the first rising edge of serial clock (C) after chip select (S#) is driven LOW. Then, the 1-byte command code must be shifted into the device, most significant bit first, on DQ0 and DQ1, with each bit latched on the rising edges of C. Every command sequence starts with a 1-byte command code. Depending on the command, this command code might be followed by address or data bytes, by address and data bytes, or by neither address nor data bytes. For the following commands, the shifted-in command sequence is followed by a data-out sequence. S# can be driven HIGH after any bit of the data-out sequence is being shifted out. • READ DATA BYTES (READ) • READ DATA BYTES at HIGHER SPEED • READ STATUS REGISTER For the following commands, S# must be driven HIGH exactly at a byte boundary. That is, after an exact multiple of eight clock pulses following S# being driven LOW, S# must be driven HIGH. Otherwise, the command is rejected and not executed. • • • • • • • • PAGE WRITE PAGE PROGRAM PAGE ERASE SECTOR ERASE WRITE ENABLE WRITE DISABLE DEEP POWER-DOWN RELEASE FROM DEEP POWER-DOWN All attempts to access the memory array are ignored during a WRITE STATUS REGISTER, PROGRAM, or ERASE command cycle. In addition, the internal cycle for each of these commands continues unaffected. PDF: 09005aef845660fc m45pe40.pdf - Rev. D 08/15 EN 15 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2011 Micron Technology, Inc. All rights reserved. 75MHz, Serial Peripheral Interface Flash Memory Command Set Overview Table 5: Command Set Codes Command Name Bytes 1-Byte Command Code Address Dummy Data WRITE ENABLE 0000 0110 06h 0 0 0 WRITE DISABLE 0000 0100 04h 0 0 0 READ IDENTIFICATION 1001 1111 9Fh 0 0 1 to 20 READ STATUS REGISTER 0000 0101 05h 0 0 1 to ∞ READ DATA BYTES 0000 0011 03h 3 0 1 to ∞ READ DATA BYTES at HIGHER SPEED 0000 1011 0Bh 3 1 1 to ∞ PAGE WRITE 0000 1010 0Ah 3 0 1 to 256 PAGE PROGRAM 0000 0010 02h 3 0 1 to 256 PAGE ERASE 1101 1011 DBh 3 0 0 SECTOR ERASE 1101 1000 D8h 3 0 0 DEEP POWER-DOWN 1011 1001 B9h 0 0 0 RELEASE from DEEP POWER-DOWN 1010 1011 ABh 0 0 0 PDF: 09005aef845660fc m45pe40.pdf - Rev. D 08/15 EN 16 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2011 Micron Technology, Inc. All rights reserved. 75MHz, Serial Peripheral Interface Flash Memory WRITE ENABLE WRITE ENABLE The WRITE ENABLE command sets the write enable latch (WEL) bit. The WEL bit must be set before execution of every PAGE WRITE, PAGE PROGRAM, PAGE ERASE, and SECTOR ERASE command. The WRITE ENABLE command is entered by driving chip select (S#) LOW, sending the command code, and then driving S# HIGH. Figure 6: WRITE ENABLE Command Sequence 0 1 2 3 4 5 6 7 C S# Command bits DQ[0] 0 0 0 0 0 LSB 1 1 0 MSB DQ1 High-Z Don’t Care PDF: 09005aef845660fc m45pe40.pdf - Rev. D 08/15 EN 17 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2011 Micron Technology, Inc. All rights reserved. 75MHz, Serial Peripheral Interface Flash Memory WRITE DISABLE WRITE DISABLE The WRITE DISABLE command resets the write enable latch (WEL) bit. The WRITE DISABLE command is entered by driving chip select (S#) LOW, sending the command code, and then driving S# HIGH. The WEL bit is reset under the following conditions: • • • • • • Power-up Completion of WRITE DISABLE operation Completion of PAGE WRITE operation Completion of PAGE PROGRAM operation Completion of PAGE ERASE operation Completion of SECTOR ERASE operation Figure 7: WRITE DISABLE Command Sequence 0 1 2 3 4 5 6 7 C S# Command bits DQ[0] 0 0 0 0 0 LSB 1 0 0 MSB DQ1 High-Z Don’t Care PDF: 09005aef845660fc m45pe40.pdf - Rev. D 08/15 EN 18 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2011 Micron Technology, Inc. All rights reserved. 75MHz, Serial Peripheral Interface Flash Memory READ IDENTIFICATION READ IDENTIFICATION The READ IDENTIFICATION command reads the following device identification data: • Manufacturer identification (1 byte): This is assigned by JEDEC. • Device identification (2 bytes): This is assigned by device manufacturer; the first byte indicates memory type, and the second byte indicates device memory capacity. • A unique ID code (UID) (17 bytes, 16 available upon customer request): The first byte contains the length of the data to follow; the remaining 16 bytes contain optional customized factory data (CFD) content. Table 6: READ IDENTIFICATION Data-Out Sequence Device Identification UID Manufacturer Identification Memory Type Memory Capacity CFD Length CFD Content 20h 40h 13h 10h 16 bytes Note: 1. The CFD bytes are read-only and can be programmed with customer data upon demand. If customers do not make requests, the devices are shipped with all the CFD bytes programmed to 0. A READ IDENTIFICATION command is not decoded while an ERASE or PROGRAM cycle is in progress and has no effect on a cycle in progress. The device is first selected by driving chip select (S#) LOW. Then, the 8-bit command code is shifted in, and content is shifted out on serial data output (DQ1) as follows: the 24-bit device identification stored in memory, then the 8-bit CFD length, followed by 16 bytes of CFD content. Each bit is shifted out during the falling edge of the serial clock (C). The READ IDENTIFICATION command is terminated by driving S# HIGH at any time during data output. When S# is driven HIGH, the device is put in the standby power mode and waits to be selected so that it can receive, decode, and execute commands. PDF: 09005aef845660fc m45pe40.pdf - Rev. D 08/15 EN 19 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2011 Micron Technology, Inc. All rights reserved. 75MHz, Serial Peripheral Interface Flash Memory READ STATUS REGISTER Figure 8: READ IDENTIFICATION Command Sequence 0 7 16 15 8 31 32 C LSB Command DQ0 MSB LSB LSB DOUT High-Z DQ1 DOUT DOUT MSB DOUT MSB Manufacturer identification LSB DOUT DOUT MSB Device identification UID Don’t Care READ STATUS REGISTER The READ STATUS REGISTER command allows the status register to be read. The status register may be read at any time, even while a PROGRAM, ERASE, or WRITE STATUS REGISTER cycle is in progress. When one of these cycles is in progress, it is recommended to check the write in progress (WIP) bit before sending a new command to the device. It is also possible to read the status register continuously. Figure 9: READ STATUS REGISTER Command Sequence 0 7 8 9 10 11 12 13 14 15 C LSB Command DQ0 MSB LSB DQ1 High-Z DOUT DOUT DOUT DOUT DOUT DOUT DOUT DOUT DOUT MSB Don’t Care PDF: 09005aef845660fc m45pe40.pdf - Rev. D 08/15 EN 20 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2011 Micron Technology, Inc. All rights reserved. 75MHz, Serial Peripheral Interface Flash Memory READ STATUS REGISTER Figure 10: Status Register Format b7 0 b0 0 0 0 0 0 WEL WIP Write enable latch bit Write in progress bit WIP Bit The write in progress (WIP) bit is a volatile read-only bit that indicates whether the memory is busy with a WRITE, a PROGRAM, or ERASE cycle. When the WIP bit is set to 1, a cycle is in progress; when the WIP bit is set to 0, a cycle is not in progress. WIP is set and reset automatically by the internal logic of the device. WEL Bit The write enable latch (WEL) bit is a volatile read-only bit that indicates the status of the internal write enable latch. When the WEL bit is set to 1, the internal write enable latch is set; when the WEL bit is set to 0, the internal write enable latch is reset and no WRITE , PROGRAM, or ERASE command is accepted. The WEL bit is set and reset by specific commands. PDF: 09005aef845660fc m45pe40.pdf - Rev. D 08/15 EN 21 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2011 Micron Technology, Inc. All rights reserved. 75MHz, Serial Peripheral Interface Flash Memory READ DATA BYTES READ DATA BYTES The device is first selected by driving chip select (S#) LOW. The command code for READ DATA BYTES is followed by a 3-byte address A[23:0], with each bit latched in during the rising edge of the serial clock (C). The memory contents at that address are then shifted out on a serial data output (DQ1), with each bit shifted out at a maximum frequency fR during the falling edge of C. The first byte addressed can be at any location. The address is automatically incremented to the next-higher address after each byte of data is shifted out. Therefore, the entire memory can be read with a single READ DATA BYTES command. When the highest address is reached, the address counter rolls over to 000000h, allowing the read sequence to be continued indefinitely. The READ DATA BYTES command is terminated by driving S# HIGH. S# can be driven HIGH at any time during data output. Any READ DATA BYTES command issued while an ERASE, PROGRAM, or WRITE cycle is in progress is rejected without any effect on the cycle that is in progress. Figure 11: READ DATA BYTES Command Sequence 0 7 8 Cx C LSB MSB DQ1 A[MIN] Command DQ[0] A[MAX] DOUT High-Z DOUT DOUT DOUT DOUT DOUT DOUT LSB DOUT DOUT MSB Don’t Care Notes: PDF: 09005aef845660fc m45pe40.pdf - Rev. D 08/15 EN 1. Cx= 7 + (A[MAX] + 1). 2. Address bits A[23:19] are "Don't Care" in the M25PE40. 22 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2011 Micron Technology, Inc. All rights reserved. 75MHz, Serial Peripheral Interface Flash Memory READ DATA BYTES at HIGHER SPEED READ DATA BYTES at HIGHER SPEED The device is first selected by driving chip select (S#) LOW. The command code for the READ DATA BYTES at HIGHER SPEED command is followed by a 3-byte address A[23:0] and a dummy byte, with each bit latched in during the rising edge of the serial clock (C). The memory contents at that address are then shifted out on a serial data output (DQ1) at a maximum frequency fC, during the falling edge of C. The first byte addressed can be at any location. The address is automatically incremented to the next-higher address after each byte of data is shifted out. Therefore, the entire memory can be read with a single READ DATA BYTES at HIGHER SPEED command. When the highest address is reached, the address counter rolls over to 000000h, allowing the read sequence to be continued indefinitely. The READ DATA BYTES at HIGHER SPEED command is terminated by driving S# HIGH. S# can be driven HIGH at any time during data output. Any READ DATA BYTES at HIGHER SPEED command issued while an ERASE, PROGRAM, or WRITE cycle is in progress is rejected without any effect on the cycle that is in progress. Figure 12: READ DATA BYTES at HIGHER SPEED Command Sequence 0 7 8 Cx C LSB A[MIN] Command DQ0 MSB DQ1 A[MAX] DOUT High-Z DOUT DOUT DOUT DOUT DOUT DOUT LSB DOUT DOUT MSB Dummy cycles Notes: PDF: 09005aef845660fc m45pe40.pdf - Rev. D 08/15 EN Don’t Care 1. Cx= 7 + (A[MAX] + 1). 2. Address bits A[23:19] are "Don't Care" in the M25PE40. 23 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2011 Micron Technology, Inc. All rights reserved. 75MHz, Serial Peripheral Interface Flash Memory PAGE WRITE PAGE WRITE The PAGE WRITE command allows bytes in the memory to be programmed. Before a PAGE WRITE command can be accepted, a WRITE ENABLE command must be executed. After the WRITE ENABLE command has been decoded, the device sets the write enable latch (WEL) bit. The PAGE WRITE command is entered by driving chip select (S#) LOW, followed by the command code, 3 address bytes, and at least 1 data byte on a serial data input (DQ0). The reset of the page remains unchanged if no power failure occurs during this WRITE cycle. The PAGE WRITE command performs a PAGE ERASE cycle even if only 1 byte is updated. If the eight least-significant address bits A[7:0] are not all 0, all transmitted data that goes beyond the end of the current page is programmed from the start address of the same page; that is, from the address whose eight least-significant bits A[7:0] are all 0. S# must be driven LOW for the entire duration of the sequence. If more than 256 bytes are sent to the device, previously latched data is discarded, and the last 256 data bytes are guaranteed to be programmed correctly within the same page. If fewer than 256 data bytes are sent to device, they are correctly programmed at the requested addresses without any effect on the other bytes of the same page. For optimized timings, it is recommended to use the PAGE WRITE command to program all consecutive targeted bytes in a single sequence rather than to use several PAGE WRITE command sequences, each containing only a few bytes. S# must be driven HIGH after the eighth bit of the last data byte has been latched in; otherwise, the PAGE WRITE command is not executed. As soon as S# is driven HIGH, the self-timed PAGE WRITE cycle is initiated. While the PAGE WRITE cycle is in progress, the status register may be read to check the value of the write in progress (WIP) bit. The WIP bit is 1 during the self-timed PAGE WRITE cycle and 0 when the cycle is completed. At some unspecified time before the cycle is completed, the write enable latch (WEL) bit is reset. A PAGE WRITE command is not executed if it applies to a page that is hardware-protected. Any PAGE WRITE command while an ERASE, PROGRAM, or WRITE cycle is in progress is rejected without having any effect on the cycle that is in progress. Figure 13: PAGE WRITE Command Sequence 0 7 8 Cx C LSB A[MIN] LSB DIN Command DQ[0] MSB A[MAX] Notes: PDF: 09005aef845660fc m45pe40.pdf - Rev. D 08/15 EN DIN DIN DIN DIN DIN DIN DIN DIN MSB 1. Cx= 7 + (A[MAX] + 1). 2. Address bits A[23:19] are "Don't Care" in the M25PE40. 3. 1
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